ADHESIVES

Adhesives for Dissimilar Materials

Hard-to-bond substrates ・ PU hot melt ・ Adhesive film and primers
RELATED RANGEWater-based PU resin·Foam coating·Adhesives

We are not going to hand you a what-bonds-to-what chart

Not because we cannot, but because that chart would mislead you. Take the same two substrates, change the surface treatment, change the machine, change the oven ceiling, and the answer changes completely — sometimes what bonded fine yesterday delaminates by the batch on a different line. There are a great many combinations we can bond. What decides the outcome is never just the adhesive.

Forms we supply

We supply different forms of adhesive according to your substrates, process conditions and equipment:

  • Water-based liquid
  • Solvent-based liquid
  • Granules
  • Strips and blocks
  • Powder
  • Film (adhesive film)

Cure mechanisms

Beyond the form, the way it cures is chosen to suit your process:

  • Hot melt
  • Moisture cure
  • One-component ・ Two-component
  • Ambient dry ・ Heat dry

The supporting auxiliaries include hardeners, accelerators, primers, thinners and cleaners — different substrates usually need different priming, and that is often what actually decides whether the bond holds.

Cross-section of a dissimilar-material bond: two different substrates, each with its own surface treatment, joined by the adhesive layerSubstrate ASurface treatment / primerAdhesive layerSurface treatment / primerSubstrate B, a different materialThe two amber layers are what matters: the same adhesive on a different surface treatment can behave completely differently.
This is why no chart can answer what bonds to what. The variables are not only in the adhesive, but in the surface state on both sides and in your process conditions.

PU hot melt range

We supply a full range of PU hot melt adhesives and their auxiliaries, including TPU hot melt granules, solvent-based PU hot melt and water-based PU hot melt. The range of use is wide, mainly as bonding layers in leather, textiles, synthetic leather and footwear materials.

  • Activation temperatureFrom 60℃ to 180℃ depending on the product
  • Application methodsDirect coating, transfer coating, lamination, roller and gravure coating, printing and dot printing, spraying

Why we talk first and quote second

Multiply the three sets above — form, cure mechanism, application method — and you can see how many possible routes there are. Picking the right one is not a catalogue exercise; it comes from understanding your conditions.

We would rather spend twenty minutes on the phone than have you take the wrong adhesive into a trial run. It is usually one call or one meeting, and it saves a great deal of what comes after.

The questions we will ask you

  • What is being bonded? What is each face made of? Any plating, anodising or release agent on the surface?
  • Process conditions? Coating method, maximum oven temperature, line speed, pressing conditions.
  • Required properties of the finished product? Peel strength, hydrolysis resistance, temperature resistance, reliability testing.
  • Expected annual volume and production timeline?

We will also assess the overall cost and technical hurdles with you first, so things move faster for both sides.

Gabriel's materials are usually not the cheapest.

But the cost of an adhesive was never the unit price. A bond that fails means rework; an inconsistent batch means a stopped line; a complaint coming back means scrapping the lot. That is the real cost. We look at the processing method, treatment steps, labour hours and yield as a whole.

If all you need is the lowest unit price, the market has plenty of options. If you are solving a problem nobody else can solve — then we should talk.

Tell us about the bond that is not holding

Tell us as much as you can: the substrates being bonded, your process conditions, and the properties the finished product has to meet. The more detail, the more precise our answer.

contact@yourgabriel.com
+886-2-2570-1213

Related: Electronics & 3C Materials | Water-based PU Resin | FAQ

Further reading: Bonding dissimilar materials: no shortcut, only conversation